The temperature cycle chamber tests the performance of products under drastic temperature variations, ranging from -20℃, -40℃, and -70℃ to +180℃. It achieves this by means of rapid heating and cooling rates, typically 5℃ to 15℃ per minute, and cyclically alternating between high and low temperatures.
This process accelerates the manifestation of defects such as material thermal expansion and solder joint fractures. It is also effective in detecting thermal fatigue, cracking, or functional failures of materials caused by sudden temperature changes.
Model: TR5-100, TR5-225, TR5-500, TR5-800, TR5-1000
Standard: AAMA501, ASTM D4169-16, IEC 61215, IEC 61646, IEC61108, IEC62688, MIL-STD-811D